Green sophisticated epoxy molding compound sought right after by the market?? Not too long ago stated that the world semiconductor packaging epoxy molding compounds (EMC / Epoxy Molding Compound) or epoxy molding compound), the mid 60s of final century originated in the United States (Hysol), right after carried forward in Japan, now China has turn out to be the world’s swiftly rising EMC manufacturing nation. EMC 2006 global demand is anticipated in sixteen to 17 million tons, demand in China EMC may four tons, client demand in these substantial-finish epoxy molding compound in green is a hot topic?? High-end epoxy molding material lot of hype. China EMC particular circumstance in manufacturing business? Explained that the finish of 2006, complete manufacturing capability in China EMC complete of about 70,000 tons / yr, in which Henkel Huawei Electronics Co., Ltd., Sumitomo Bakelite Co., Ltd. in Suzhou, Changchun Feng Plastic (Changshu) Co., Ltd. Changxing Electronic Supplies ( Kunshan) Co., Ltd., Hitachi Chemical Business (Suzhou) Co., Ltd., five significant companies with each other for the 60,000 tons / year, accounting for 86% of complete production capability, other companies can generate about ten,000 tons / yr, accounting for 14% of complete production capability.
Â EMC is anticipated by the finish of 2008 China’s total capability to much more than 80,000 tons / yr. 2006 EMC Packaging in China about forty,000 tons of total use in mainland China organizations account for about 7 %, about three percent of overseas imports of EMC, the growth rate of about 20% of the next few many years. According to reviews, in 2005 Henkel Huawei Electronics Co., Ltd. by way of a joint venture to integrate the United States and the former Hysol Electronic Co., Ltd. Jiangsu CLP Warwick sources, has turn into the world’s 3 biggest manufacturers of EMC, international advertising and marketing and Hysol Hysol-Huawei this 2 large brand EMC, transformed the globe semiconductor market competition pattern EMC in 2006 Henkel Huawei Electronics Co., Ltd. to undertake the Hysol brand Transferring EMC, have been exported in massive quantities overseas, with robust global competitiveness, as U.S. factories EMC Hysol items in 2007 will be entirely transferred to Henkel Huawei Electronics Co., Ltd. factory and actively develop the overseas market and velocity up other firms to expand overseas marketplace, EMC Chinese-made exports will enhance quickly, China is expected to turn out to be the world’s semiconductor EMC lead biggest producer, China is expected EMC has grow to be the world’s No. two producer of big capacity.
Â Domestic R & D previously has a strength, primary characteristics are: tiny number of institutions, relying on study institutes, domestic and foreign investments simultaneously. According to reviews, the present professional R & D institutions are: domestic Henkel Huawei Electronics Co., Ltd. of Jiangsu Province, IC packaging supplies Engineering Analysis Center, Beijing Microelectronics Co., Ltd. Relying on the very first Segment of the Chinese Academy of Sciences Chemistry foreign investment in Suzhou Sumitomo Electric Wood Co., Ltd. Hitachi Chemical Business (Suzhou) Co., Ltd. Taiwanese Changxing Electronics Supplies (Kunshan) Co., Ltd. R & D centers overseas, and other domestic organizations are no EMC specialist R & D institutions. This R & D framework determines the new solution improvement and launch, and the supply of sophisticated packaging with EMC, remains dominated by foreign capital or import grid. At the moment SOT, SSOP, TSOP, QFP, TQFP and other sophisticated packaging utilized in EMC, the Henkel Huawei Electronics Co., Ltd., Suzhou Sumitomo Bakelite Co., Ltd., Hitachi Chemical Business (in Suzhou) Co., Ltd., a huge-scale manufacturing, and has in a big number of domestic enterprises to use foreign package deal, dominant Changxing Electronic Components (Kunshan) Co., Ltd. and Beijing’s first Division of Microelectronics, also encourage the growth of new items now.
Â Sumitomo Bakelite Co., Ltd. Suzhou IC bundle largely high-finish products are the principal, dominant Henkel Huawei Electronics Co., one the complete income volume, income of high-grade EMC two, with most of China’s packaging industry’s require for higher , in reduced-finish epoxy molding compound, product line comprehensive. Henkel Huawei Electronics Co., Ltd. presently developed SSOP, TQFP, QFN, BGA and other advanced packaging used EMC reached the international innovative level and has been totally recognized in the market, production and sales expanded rapidly. According to reviews, the international EMC to epoxy resin system is divided into: ECON, DCPD, Bi-Pheny1 and Multi-Perform variety, and so on. The primary items in the domestic capital for SMEs centered ECON epoxy resin system EMC, applies to a broad assortment of big Chinese diodes, transistors and other widespread packages for SMEs, but there is a lower degree of brand recognition, solution consistency is bad, weak technological innovation troubles need to be resolved, and the EMC demands five -ten minimal temperature refrigerated transport and storage, resulting in high logistics value, thereby limiting the lack of assets, tiny-scale domestic modest and medium companies increase the nationwide marketplace, generally in the local region industry to lower-value competitors. MCM (MCP), FBP, BGA, CSP, MEMS, SiP and other sophisticated packaging with EMC is still the major imports, neighborhood manufacture of EMC also promote testing and certification process on the volume.
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